1. Applications of experimental mechanics to electronic packaging -1997- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Author: sponsored by the Electrical and Electrnic Packaging Division, ASME, the Applied Mechanics Division, ASME; edited by J.C. Suhling, K.M. liechti, S. Liu
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses , Mechanics, Applied - Congresses
Classification :
TK
7870
.
15
.
A643
1997
